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stw1147ask - tr page : 1 outer dimension 2.4 x 1.85 x 0.6mm ( l x w x h ) diffused pale yellow color lens standard product reference sheet features recommended applications package product features ? thinner package, white color emitting led ? lead C free soldering compatible ? rohs compliant ? mainly : flash light for mobile phone ? others : amusement equipment, home appliances, oa/fa equipment, other general lighting use, etc. 2014.2.19
stw1147ask - tr unit :mm weight :5.4mg tolerance : 0.1mm outline dimensions recommended soldering pattern unit mm page : 2 2014.2.19 no. part name materials led die ingan lamp housing glass fabric terminal au plating encapsulant silicone resin
stw1147ask - tr specifications page : 3 2014.2.19 1.3 ma/ ingan white product overview resin color (lamp housing) power dissipation p d die material emitting color absolute maximum ratings item symbol maximum ratings unit mw please refer to page 9, soldering conditions. symbol item i frm 100 t opr reverse voltage v r 5 i f 50 (ta=25 ) flash frequency is within 100,000 times. i frm 2.5 ma/ 260 ma operating temperature soldering temperature "reflow soldering" thermal characteristics junction temperature 100 - 40 +100 note 1 note 2 i f derate linearly from "60 " repetitive peak forward current " tw Q 500ms, duty Q 1/5 " i frm derate linearly from "60 " tj storage temperature t stg - 40 +85 resin color (emitting area) diffused pale yellow note1 typ. thermal resistance junction - ambient r th(j-a) /w note3 thermal resistance junction - solder point r th(j-s) /w 200 80 units ma 200 (ta=25 ) white note2 forward current v t sld i f max. - - note3 rth(j-a) measurement condition substrate:fr4 ( t=1.6mm ) pattern size : 16mm 2
stw1147ask - tr specifications page : 4 2014.2.19 - cd note5 note4,6 note7 note6 chromaticity coordinate x,y coordinate according to cie1931 - - 0.36 reverse current i r i f = 40ma - - 50 note4 half intensity angle i f = 40ma deg. 115 luminous intensity 2 500ms 1 time turn on (1 pulse) i v i f = 100ma - chromaticity coordinate luminous intensity 1 luminous flux 12.4 - x 8.2 - cd min. typ. max. 3.5 a unit - item symbol conditions - i f = 40ma i f = 40ma lm - 115 4.2 0.3 6.8 - v f 3.9 (ta=25 ) i f = 40ma v i f = 40ma electro and optical characteristics y - ? y 2.7 i f = 40ma - forward voltage i v v - ? x note7 viewing angle at 50% iv, ? x ; housing long side axis, ? y ; housing short side axis note5 measuring time : 500ms, 1 pulse note4,6 please refer to the following sorting charts. if = 40ma ta=25 tolerance : each rank 10% i v (cd) dz 4.2 leds shall be sorted out into the following chart and each rank parts shall be packed separately when shipping. 2.7 min. dy max. rank condition 4.2 6.8 sorting for luminous intensity
stw1147ask - tr specifications page : 5 2014.2.19 sorting chart for chromaticity coordinates chromaticity coordinates shall be sorted out into the following chart and each rank parts shall be packed separately when shipping. 0.2834 0.3312 y 0.3304 0.3783 x 0.3282 0.3783 0.3527 0.4261 0.3791 toleranse : each rank 0.02 4h 0.3282 0.3372 0.3128 x 4g x 0.3038 x y right up right down ( i f =40ma, ta=25 ) rank 0.3617 y 0.3372 y 0.3312 left down left up
stw1147ask - tr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 spatial distribution conditions: ta = 25 , i f =10ma relative intensity : (%) wavelength vs. relative intensity conditions: ta = 25 , i f =40ma wavelength: (nm ) relative intensity technical data 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 100 50 0 50 100 x direction y direction page : 6 2014.2.19
stw1147ask - tr 0.1 1 10 -40 -20 0 20 40 60 80 100 ambient temperature vs. relative intensity condition : i f = 4 0ma ambient temp. : ta ( ) 0 0.5 1 1.5 2 0 10 20 30 40 50 60 70 80 90 100 ci 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 -40 -20 0 20 40 60 80 100 1 10 100 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 forward voltage vs. forward current condition : ta = 25 forward voltage : v f (v ) forward current : i f (ma ) forward current vs. relative intensity condition : ta = 25 , 500msc drive ( 1 pulse) forward current: i f ( ma) relative intensity technical data relative intensity ambient temperature vs. forward voltage condition : i f = 4 0ma ambient temp. : ta ( ) forward voltage: v f (v) page : 7 2014.2.19
stw1147ask - tr 1 10 100 1 10 100 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 dc duty 50% duty 40% duty 30% duty 20% 0.35 0.36 0.37 0.38 0.32 0.33 0.34 60 25 40 0 85 0.35 0.36 0.37 0.38 0.32 0.33 0.34 10ma 5ma ci 20ma 40ma 50ma 60ma 80ma 100ma duty ratio vs. max . forward current condition: ta = 25 duty ratio: (%) maximum forward current vs. ambient temp . condition : rth(j - a)=200 /w, pulse width < 500msec ambient temperature : ta ( ) chromaticity coordinates vs. ambient temp. condition : i f =40ma technical data chromaticity coordinates vs. forward current condition : ta=25 maximum forward current : i f max. (ma) maximum forward current : i f max. (ma) page : 8 2014.2.19
stw1147ask - tr page : 9 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) page : 9 2014.2.19 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
stw1147ask - tr soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended . the curing condition, temperature:150 max./time:120sec.max. 7. flow soldering (dip soldering) is not recommended for this product . 8. lsopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability isopropyl alcohol trichloroethylene chlorothene acetone thinner page : 10 2014.2.19
stw1147ask - tr handling precaution for electric static discharge ( esd) led with an ingan die is sensitive to voltage surges generated by on/off status change and frictions with synthetic materials, which may cause severe damage to the die or undermine its reliability. damaged products may experience conditions such as extremely high reverse voltage, decrease of forward rise voltage, deteriorating its optical characteristic. stanley ingan products are packed with anti - static components. however , following precautions must be taken in to account upon product shipment. 1. electrification/static electricity protection in order to avoid product (die) damage from static electricity caused by electrified operator and other materials electrified friction coming in contact with the product, stanley recommends taking the following precautions. do not place electrified non - conductive materials near the led product. (avoid led products form coming in contact with metallic materials, should the metallic material be electrified, sudden surge voltage will most likely damaged the product .) avoid working process which may cause the led product slide/rub against other materials . install ground wires for any equipment, which can be installed with such measures to avoid static electricity . prepare a esd protective area by placing conductive mattress (1m ) and ionizer to remove any static electricity. operators should wear a protective wrist - strap . (typically, protective wrist - strap will be equipped with 1m resistors in series connection .) operators should wear conductive work - clothes, shoes and work on a conductive floor . to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. dry environment is more likely to cause static electricity. although dry environment is ideal during storage state of led products, during the soldering process, stanley recommends an environment with approximately 50% humidity . recommended static electricity level in the working environment is 150v, which is the same value as integrated circuits. 2. working environment page : 11 2014.2.19
stw1147ask - tr handling precaution other precautions 1. the products are designed to achieve the highest performance reliability, however they can be influenced by usage conditions . 2. absolute maximum ratings are set to prevent led products from breaking due to extreme stress (temperature , current, voltage, etc.). these ratings must never be overrun even for a moment. 3. to achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage adjusted to the usage temperature condition, derating of the power consumption, and other variable factors. 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from overheating. 5. please avoid to stick foreign material because molding resin in the products has adhesiveness . and please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for single led. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to perform without failure in the recommended usage conditions. however , please take the necessary precautions to prevent fire, injury, and other damages from these unexpected failures. 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff in advance when exceptional quality and reliability are required, when the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on .) 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package ( junction part of die bonding and wire bonding). please use after affirming beforehand there is no problem. 11. the formal specification sheets should be exchanged and signed by both parties . page : 12 2014.2.19
stw1147ask - tr 1. picking up point with nozzle: lamp housing of the product ( area) ( shown below) recommendation the picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (if the nozzle makes contact with the lens, the products might be destroyed) handling precaution handling precautions for product mounting please adjust the load, the pick up point, the nozzle diameter, etc. before mounting because the over load can cause the breakage of the lamp housing. load : less than10n to avoid product breaking page : 13 2014.2.19
stw1147ask - tr packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is maximum 72h . if the device needs to be soldered twice, both soldering operations must be completed within the 3days(72h). if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at least 48h ( min .) and not exceed for 72h(max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of color indicators (those are in the package of desiccant ) change or lose its blue color. 2 . in the case of time passed for 72h after the package is opened once . baking process should be performed after putting out from package. baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 14 2014.2.19
stw1147ask - tr packaging specification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting page : 15 2014.2.19 sym. part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
stw1147ask - tr packing box ( rohs ? elv compliant) the above measure is all the reference value. the box is selected out of the above table by shipping quantity. packaging specifications b type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5af box type outline dimension l w h (mm) capacity of the box type a 280 265 45 3 reels type b 310 235 265 15 reels type c 440 310 265 30 reels page : 16 2014.2.19
stw1147ask - tr label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number bar - code font : acc.to code - 39(jix0503) packaging specifications b a page : 17 2014.2.19
stw1147ask - tr taping and reel specifications (acc.to jis - c0806 - 03 appearance note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 25 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 40 pieces. the end of taping shall be inserted into a slit of the hub. page : 18 2014.2.19
stw1147ask - tr taping and reel specifications ( acc.to jis - c0806 - 03 qty. per reel mechanical strength others 4 ,000parts/reel minimum qty. per reel might be 500 parts when getting less than 4,000 parts. in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held. max. qty. of empty pocket per reel shall be defined as follows. page : 19 2014.2.19 2 no continuance 3,000 3 no continuance 3,500 3 4,000 4 no continuance 1 1 - 2,000 no continuance n o continuance 1 2 1,000 1,500 - - qty./reel max.qty. of empty pocket r emarks 2,500 500
stw1147ask - tr taping dimensions reel dimensions taping and reel specifications ( acc.to jis - c0806 - 03 unit mm page : 20 2014.2.19 carrier-tape anti-static grade cover-tape conductive grade conductive grade carrier-reel no. part name remarks
stw1147ask - tr lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 2009 9,2010 0,2011 1, ??? ) - 2digits production month (jan. to sep. , should be 01,02,03, ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digits chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 21 2014.2.19
stw1147ask - tr correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 22 2014.2.19
stw1147ask - tr reliability testing result 1. reliability testing result 2. failure criteria item symbol condition failure criteria luminous intensity i v i f =20ma testing min. value standard min. value 0.5 forward voltage v f i f =20ma testing max. value R standard max. value 1.2 reverse current i r v r =5v testing max. value R standard max. value 2.5 cosmetic appearance - - notable discoloration, deformation and cracking reference test test item criteria test condition duration failure operating life eiaj ed - 4701 /100(101) ta=25 maximum rated current 1,000h 0 /20 high temperature operating life eiaj ed - 4701 /100(101) ta=85 maximum rated current 1,000h 0 /20 low temperature operating life eiaj ed - 4701 /100(101) ta= - 40 maximum rated current 1,000h 0 /20 wet high temperature operating life eiaj ed - 4701 /100(102) ta=60 rh=90% maximum rated current 1,000h 0 /20 thermal shock eiaj ed - 4701 /100(105) ta= tstg max. tstg min. (each 15min) 200 cycles 0 /20 resistance to reflow soldering eiaj ed - 4701 /300(301) moisture soak 30 70% 72h preheating 150 180 90 120sec. soldering 260 max 2 times 0 /20 electric static discharge (esd) eiaj ed - 4701 /300(304) c=100pf r2=1.5k 1 , 000 v once of each polarity 0 / 10 page : 23 2014.2.19
stw1147ask - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 24 2014.2.19

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